- All sections
- C - Chemistry; metallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatings; electroforming; joining workpieces by electrolysis; apparatus therefor
- C25D 3/60 - Electroplating; Baths therefor from solutions of alloys containing more than 50% by weight of tin
Patent holdings for IPC class C25D 3/60
Total number of patents in this class: 200
10-year publication summary
|
20
|
19
|
19
|
19
|
20
|
13
|
10
|
5
|
8
|
4
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Materials Corporation | 2378 |
25 |
| Rohm and Haas Electronic Materials LLC | 637 |
21 |
| BASF SE | 19740 |
12 |
| The Boeing Company | 19843 |
7 |
| Novellus Systems, Inc. | 559 |
7 |
| Atotech Deutschland GmbH | 586 |
6 |
| Senju Metal Industry Co., Ltd. | 654 |
6 |
| Technic, Inc. | 40 |
6 |
| Dow Global Technologies LLC | 10147 |
4 |
| Umicore Galvanotechnik GmbH | 55 |
4 |
| DIPSOL Chemicals Co., Ltd. | 57 |
3 |
| Dr.-Ing. Max Schlotter GmbH & Co. KG | 24 |
3 |
| JFE Steel Corporation | 6067 |
3 |
| Okuno Chemical Industries Co., Ltd. | 95 |
3 |
| International Business Machines Corporation | 60644 |
2 |
| Sumitomo Electric Industries, Ltd. | 14131 |
2 |
| Robert Bosch GmbH | 40953 |
2 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
2 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
2 |
| Lam Research Corporation | 4775 |
2 |
| Other owners | 78 |